The highest bump height-to-pitch ratio (H/P) possible with today solder paste and stencil technologies was determined using different pulse-stencil-pitch combination.Anal. of the different combination plots revealed three main trends.First, the finer Type 6 powder yielded a higher average H/P ratio.This was a result of higher packing d. which led to more solder deposited per unit μm3 of printed solder volumeSecond, round apertures produced the majority of the maximum H/P ratios.Lastly, as pitch increases, so does the H/P ratio.Since the denomination of the ratio is pitch, it was anticipated that the H/P ratio should be a straight line when plotted against pitch.One theory is that since the webbing dimension is independent of pitch, a larger percentage of the available printing real estate is consumed by the webbing.
