Several years ago, an apparatus devised by Nakahara, Okinaka, and Turner, suitable for frequent determinations of the ductility of thin metallic films produced by electrodeposition and other processes, was replicated and used in an ASTM interlaboratory test program designed to determine the precision and accuracy of the method. The material used in the interlaboratory study was Ni deposited from sulfamate solutions The ductility of Ni electrodeposits from sulfamate baths, as determined by conventional uniaxial tensile testing, is discussed and compared with the data gathered to assess the method.
