The conductive pastes containing Ag particles are used for patterning the electrodes of electronic devices such as solar cells and touch screen panels. Although Cu@Ag type metal particles have been tried as a substitute instead of Ag for cost reduction, the dewetting of Ag from Cu core during the processes has limited the use of Cu as a core metal. In this work, to investigate the Cu-Ni alloys as the core metal, we analyze the surface structures of Cu-Ni alloys and measure the compatibility between Ag and Cu-Ni alloys as wells as Cu and Ni by calculating the contact angles of Ag droplet on the metal surfaces using mol. dynamics simulations. As the Ni content of Cu-Ni alloys increases, the contact angle decreases: the contact angles for Cu, Cu3Ni, CuNi, CuNi3, and Ni are 69.6, 52.6, 50.5, 45.1, and 8.9°, resp. Therefore, the wettability of Ag on the Cu-Ni alloys is improved with the Ni content in the Cu-Ni alloys. This result indicates that the Cu-Ni alloys could be good candidates as the core metal to be used in the metal particles for the conductive pastes.